DNP to Exhibit at SEMICON Japan 2024

Tokyo, December 2, Dai Nippon Printing Co., Ltd. (DNP) will exhibit at SEMICON Japan 2024 to be held at the International Exhibition Center of Tokyo Big Sight from December 11h to 14th, 2024. 

DNP is focused on semiconductor-related businesses as a key business area. We utilize our proprietary core technologies, such as Micro Processing Technology and Precision Coating Technology, to provide photomasks that serve as the master plates used in the production of semiconductor fine circuit patterns. We also provide next-generation semiconductor packaging materials. 

TheDNP booth at this year's exhibit will be located at East Hall 1, booth 1942, and will feature a wide range of products and services that support front-end processes, such as semiconductor design, and back-end processes, such as packaging.

For more information about SEMICON Japan 2024 please visit : https://www.global.dnp/biz/eventseminar/event/20175995_4123.html 

Image of DNP booth

DNP Exhibits

At the DNP booth, we will be showcasing a wide range of products and services that support semiconductor manufacturing from front-end to back-end processes. These include our responses to the miniaturization of semiconductor circuits and initiatives in next-generation semiconductor package substrates for photonics-electronic integration that combine circuits handling electrical and optical signals. 

DNP will continue to support the foundations of the information society through our semiconductor-related business, and contribute to enriching lifestyles.

Semiconductor Manufacturing Front-end Processes 

Design and development support 

DNP LSI Design Co., Ltd., a member of the DNP Group, will introduce IC (Integrated Circuit) and LSI (Large Scale Integration) design, prototyping, and mass production contract services, while also exhibiting sample chips. 

Photomasks for Semiconductor Manufacturing

DNP is the first specialized photomask outsourcing supplier to use a multi-electron beam mask writer to supply high-precision photomasks around the world. Continuing from last year, the DNP booth will showcase actual Extreme Ultra-Violet (EUV) lithography photomasks with a pellicle, for a cutting-edge process in semiconductor manufacturing.

In addition, we will exhibit Master Templates and Replica Templates for Nano-Imprint lithography. This new technology is expected to lead to the semiconductor miniaturization, while also reducing power consumption and improving semiconductor manufacturing productivity.

Semiconductor Manufacturing Back-end Processes  

Through Glass Via (TGV) glass core substrate for advanced semiconductor packages

We will exhibit a TGV glass core substrate capable of replacing conventional resin substrates, and which is compatible with higher efficiency and larger areas. High-density TGV technology makes it possible to provide higher performance semiconductor packages than those currently available.

Co-packaged optics substrate

To address the global social issue of increased power consumption at data centers, DNP will exhibit a Co-packaged Optics Substrate with optical waveguides that achieve both high-speed information processing and energy conservation. 

Film for semiconductor production processes and functional packaging materials for semiconductor products

DNP will exhibit high-performance films that can be used in the semiconductor manufacturing process by applying proprietary lamination and coating technologies to provide heat and chemical resistance. We will also exhibit packaging materials that utilize our unique materials processing and converting technologies to improve convenience at manufacturing sites.

Heat dissipating components: Vapor chamber with for soldering reflow

We will exhibit a vapor chamber that has extremely high thermal conductivity and can transport and diffuse heat from semiconductor devices. DNP's proprietary design enables this thin, flexible, and highly heat-resistant product.

*Product specifications and service details referred to in this news release are current as of the date of the announcement. They may be changed without notice.