This clean packaging material is specifically designed for products such as semiconductors, electronic components, and precision parts, which require stringent particle and contamination control. It features a double-layered structure with inner and outer bags integrated into a single unit, allowing for easy double packaging. With its high cleanliness and excellent workability, UCPF is used in a wide array of products used in clean rooms and is highly regarded in the semiconductor industry.

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UCPF is a clean packaging material that can be used in Class 100 clean rooms. We customize UCPF to meet customers' requirements, such as changing the size and materials used, as well as adding barrier properties. The bag shape is engineered to be opened without the use of tools for both the outer and inner bags.
The bag is highly durable, making it suitable for parts with hard, sharp-edged protrusions.

In addition, because of how the inner and outer bags are integrated, double packaging is simplified.
Our products can reduce packaging time by approximately half, so the energy consumption of the equipment used during packaging can also be halved.

Semiconductor manufacturing equipment is manufactured in clean rooms with a high level of cleanliness. In particular, parts used near vacuum chambers (gaskets, valves, fittings, filters, screws, metal targets, etc.) and sensors (mass flow controllers, vacuum switches, etc.) require a higher degree of cleanliness and therefore require double packaging.